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JoinBond™
Thermal Interface Material > JoinBond™
JoinBond™ is liquid polymer having thermal conductivity and adhesion
to solve heat problem.
Its insulation property also blocks electrical interference between
two products and stick two products without any physical linking tool.

- Superior thermal conductivity [Min. 1.0W/m.K]
- Insulation property
- Superior adhesive strength

Application : CPU, GPU, LED module, SMPS, Laptop, LCD, etc.









CONTACT US
Sentrion Electronics(ShenZhen) Co., Ltd.

Room 1801, 18/F., Building B, Royal Plaza, No.3008 Yitian Road,
Futian District, ShenZhen, 518017, China
Tel : +86-755-8299-7481
Email : info@sentrion.cn
Website : www.sentrion.cn 		  Sentrion Corporation

RM511, 225 Gasan Digital 1-Ro,
Geumcheon-Gu, Seoul, 08501, Korea
Tel : +82-2-858-0027
Fax : +82-2-858-0028
Email : info@sentrion.co.kr
Website : www.sentrion.co.kr 		  Joinset Co., Ltd.

9B-51L, 329 Haean-Ro, Danwon-Gu
Ansan-Si, Gyeonggi-Do, 15613, Korea
Tel : +82-31-495-2601
Fax : +82-31-495-2693
Website : www.joinset.com
Copyright @ 2015 Sentrion electronics(ShenZhen) All Right Reserved.
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